07/28/2026 | Companies

3D integration, acquisition, advanced packaging, AEMtec, aerospace, Behrman Capital, Berlin, biotechnology, Boston, Capiton, chip-on-board, cleanroom manufacturing, continental Europe, defense, Dresden, engineering footprint, engineering services, European expansion, flip-chip technology, Germany, high-reliability microelectronics, industrial automation, industrialization, lifecycle support, manufacturing, manufacturing footprint, Massachusetts, medical devices, merger, microelectronics, Micross, Micross Components, mission-critical applications, optoelectronic packaging, optoelectronics, photonics, precision assembly, product lifecycle management, prototyping, qualification testing, semiconductor industry, semiconductor packaging, series production, space technology, telecommunications, wafer back-end services, wafer testing